Metallurgical Failure Analysis
Failure analysis is the systematic and logical investigation of a failed component, machine or equipment to determine the root cause of the failure.
The processes of failure analysis and investigation involve collect and review of background information, documentation, laboratory examination, testing and analysis of the failed component. Properly performed, the root causes of material failures are identified, problems are solved and recommendations are made to prevent recurrences in the future, achieving higher levels of quality and reliability.
Semiconductor Failure Analysis and Reliability Test
Semiconductor Failure analysis is important to root cause failure and provide rapid feedback to design and manufacturing stages. With high reliability demand in the market and higher integration density of the device, typical failure mechanisms like wire bond failure, delamination, broken wire, electro migration, packaging failure, contamination, electrical overstress and etc. are required to perform the failure analysis..